企业：深圳市毫欧电子有限公司
联系人：高玉英
电话：0755-28153546
手机：13798223534
网址：www.moolee.com.cn
邮箱：szgyy@126.com
传真：0755-22630181
地址：深圳市龙华区观澜镇大布头路280号南通邦高新产业园A栋8楼
特征Features
散热的铝合金外壳
Aluminum case for heat dissipation
For thermal panel installed
体积小，功率负荷大
Small size，big power load
硅铜薄膜，绝缘性好
Silicon copper film forming，good insulation
符合R0HS要求 Lead-free
TypeRated power 25℃(taken heat sink)Dimensions(mm)Standard heat sinkWeigh
(g)
ABLHII1CMNΦKSurface
Area(cm²)Thickness
(mm)
YRX245W15.51636.5811.412.58.54.41.51.21.341513
10W19.52140.510141611.25222.24156
25W2727481318.32014.37222.253511
30W34295515.5252216.37.3222.253518
50W50297115.5402216.37.3232.299530
75W65.54886.52623.5372711.53.53995390
100W98481192635372711.53.53995160
150W130481512652372711.53.53995240
100W8971.5139457057.246.519.65M52780265
200W927313245355846.5215M63750420
250W1127315245455846.5215M64750480
300W1307317045515846.5215M65780580
500W2047324445875846.5215M68500970
降功耗曲线POWER DERA TING CURVE
表面温升 SURFACE TEMPERATURE RISE
技术说明TECHINICAL SPECIFICATIONS
型号25下℃额定功率（W）阻值范围 RES.RANGES(Ω)温度系数TCR(10/℃)阻值误差（%）耐电压（V）
带散热板不带散热板
RX24-5RE605530.01~1K
RX24-10RE6101080.01~1.5K
RX24-25RE6152512.50.01~10K
RX24-3030150.01~27K
RX24-50RE63050200.01~33K
RX24-7575450.01~39K
RX24-100100500.01~51K
RX24-150150550.01~56K
RX24G-100RE640100500.01~62K
RX24G-2002001000.01~58K
RX24G-2502501200.01~75K
RX24G-3003001500.01~75K
RX24G-5005002000.01~82K
RX24G-250RE6502501200.01~75K
特性CHARACTERISTICS
实验项目TET ITEM性能要求SPECIFICATIONS试验方法TEST METHOD
SJ1330-78
可焊接性Solderability焊料能自由流动并引线润湿235±5℃，2s槽焊法
引出端强度Terminal tensile strength△R≤±（1%R+0.5Ω）40N
过载Overload△R≤±（1%R+0.5Ω）10PR,5s
温度变化resistance with temperature△R≤±（1%R+0.5Ω）-55℃~+155℃，5次循环
耐焊接热Sold heat△R≤±（1%R+0.5Ω）350±10℃，3.5±0.5S
冲击 Shook△R≤±（1%R+0.5Ω）加速度490m/s2，11ms,18次
振动Vibratious△R≤±（1%R+0.5Ω）频率10-50hz,加速度98m/s2,6h
表面升温Surface temperature Rise≤275℃VR
恒定湿热Dampheat,steady state△R≤±（5%R+0.05Ω）温度40±2℃，温度93%，21天
温度耐久性 Load Life△R≤±（5%R+0.5Ω）室温施加额定功率负荷1000h
